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Preis auf Anfrage
| Anwendungen | Backup Storage, Big Data, Cloud Computing, Data Center |
| SSDs/HDDs | 24 |
| Formfaktor | 4U |
| Max. GPU Anzahl | N/A |
| Systemtyp | JBOD |
| Gehäuse Tiefe | 26" (660 mm) |
| Speicher Formfaktor | 2.5", 3.5" |
| On-Board Netzwerk | N/A |
| Redundantes Netzteil | Redundantes Netzteil inkl. |
| Fernverwaltung | Fernverwaltung inkl. |
| Speicherschnittstelle | SAS (native), SATA (native) |
Preis auf Anfrage
| Anwendungen | Backup Storage, Big Data, Cloud Computing, Data Center |
| SSDs/HDDs | 24 |
| Formfaktor | 4U |
| Max. GPU Anzahl | N/A |
| Systemtyp | JBOD |
| Gehäuse Tiefe | 26" (660 mm) |
| Speicher Formfaktor | 2.5", 3.5" |
| Redundantes Netzteil | Redundantes Netzteil inkl. |
| Fernverwaltung | Fernverwaltung inkl. |
| Speicherschnittstelle | SAS (native), SATA (native) |
Preis auf Anfrage
| CPU | HMP Dual Denver 2/2MB L2 + Quad ARM® A57/2MB L2 |
| Speicher | 8 GB 128-bit LPDDR4 58.3 GB/s |
| Datenspeicher | 32 GB eMMC, SDIO, SATA |
| GPU | NVIDIA Pascal, 256 NVIDIA CUDA cores |
| PCIe | Gen 2 | 1x4 + 1x1 OR 2x1 + 1x2 |
| Konnektivität | 1 Gigabit Ethernet, 802.11ac WLAN, Bluetooth |
| Video | 4K x 2K 60 Hz Decode (12-bit support), 4K x 2K 60 Hz Encode (HEVC) |
| USB | USB 3.0 + USB 2.0 |
| Display | HDMI 2.0 / eDP 1.4 / 2x DSI / 2x DP 1.2 |
| CSI | Up to 6 cameras (2 lane) CSI2 D-PHY 1.1 (2.5 Gbps/lane) |
| Power | 7.5 W / 15 W* |
| Abmessung | 50 mm x 87 mm (400-pin Compatible Board to Board Connector) |
| Sonstiges | CAN, UART, SPI, I2C, I2S, GPIOs |
Preis auf Anfrage
| CPU | HMP Dual Denver 2/2MB L2 + Quad ARM A57/2MB L2 |
| Speicher | 8 GB 128-bit LPDDR4 (ECC support) |
| Datenspeicher | 32 GB eMMC, SDIO, SATA |
| GPU | NVIDIA Pascal, 256 NVIDIA CUDA cores |
| PCIe | Gen 2 | 1x4 + 1x1 OR 2x1 + 1x2 |
| Konnektivität | 1 Gigabit Ethernet |
| Video | 4K x 2K 60 Hz Decode (12-bit support), 4K x 2K 60 Hz Encode (HEVC) |
| USB | USB 3.0 + USB 2.0 |
| Display | HDMI 2.0 / eDP 1.4 / 2x DSI / 2x DP 1.2 |
| CSI | CSI2 D-PHY 1.1 (2.5 Gbps/lane), Up to 6 cameras (2 lane) |
| Power | 10 W / 20 W* |
| Abmessung | 50 mm x 87 mm (400-Pin Compatible Board-to-Board Connector) |
| Sonstiges | CAN, UART, SPI, I2C, I2S, GPIOs |
Preis auf Anfrage
| CPU | Dual-core NVIDIA Denver 2 Quad-core ARM A57 complex |
| Speicher | 4 GB 128 Bit LPDDR4 | 25.6 GB/s |
| Datenspeicher | 16 GB eMMC 5.1 |
| GPU | 256-core Pascal GPU |
| PCIe | 1x1+1x4 OR 2x1+1x2 PCIe Gen2 |
| Konnektivität | Gigabit Ethernet |
| USB | 3x USB 3.0, 3x USB 2.0 |
| Display | HDMI 2.0, eDP 1.4, DP 1.2 |
| Encoder/Decoder | 2x 4Kp60| 4x 4Kp30| 7x 1080p60| 14x 1080p30 (H.264/H.265), 4Kp60| 3x 4Kp30| 4x 1080p60| 8x 1080p30 (H.265) |
| CSI | 12 (3x4 or 6x2) lanes MIPI CSI-2 D-PHY 1.1 |
| Abmessung | 87 mm x 50 mm 400-pin Connector |
| Sonstiges | I2C, I2S, SPI, UART, SD/SDIO, SATA, GPIO |
Preis auf Anfrage
| CPU | Quad-core ARM A57 @ 1.43 GHz |
| Speicher | 4 GB 64-bit LPDDR4 25.6 GB/s |
| Datenspeicher | 16 GB eMMC 5.1 |
| GPU | 128-core Maxwell |
| PCIe | 1x1/2/4 PCIe Gen2 |
| Konnektivität | Gigabit Ethernet |
| USB | 1x USB 3.0, 3x USB 2.0 |
| Display | HDMI 2.0, eDP 1.4, DP 1.2 (two simultaneously) |
| Encoder/Decoder | 4K @ 30 | 4x 1080p @ 30 | 9x 720p @ 30 (H.264/H.265), 4K @ 60 | 2x 4K @ 30 | 8x 1080p @ 30 | 18x 720p @ 30 (H.264/H.265) |
| CSI | 12 (3x4 or 4x2) lanes MIPI CSI-2 D-PHY 1.1 |
| Power | 5 W~10 W |
| Abmessung | 69.6 mm x 45 mm 260-pin SODIMM Connector |
| Sonstiges | I2C, I2S, SPI, UART, SD/SDIO, GPIO |
Preis auf Anfrage
| CPU | 8-Core ARM v8.2 64-Bit CPU, 8 MB L2 + 4 MB L3 |
| Speicher | 32GB 256-Bit LPDDR4x| 136.5GB/s |
| Datenspeicher | 32 GB eMMC 5.1 |
| GPU | 512-Core Volta GPU with Tensor Cores |
| PCIe | (8x) PCIe Gen4 / (8x) SLVS-EC (3x) USB 3.1, Single Lane UFS |
| Konnektivität | Gigabit Ethernet |
| Display | HDMI 2.0, eDP 1.4, DP 1.2(three simultaneous) |
| Encoder/Decoder | 2x 8K30|6x 4Kp60| 12x 4Kp30| 26x 1080p60| 72x 1080p30 (HEVC), 4x4K60|8x 4Kp30|16x 1080p60| 32x 1080p30(HEVC) |
| Sehbeschleuniger | 7-Way VLIW Vision Processor |
| DL Beschleuniger | (2x) NVDLA Engines |
| CSI | 16(4x4 or 6x2or 6x1) lanes MIPI CSI-2 D-PHY 1.2 (total up to 40Gbps) C-PHY 1.1 (total up to 59Gbps |
| Größe | 87 mm x 100 mm |
| Power | 10 W~30 W |
| Abmessung | 699 pin Molex Mirror Mex Connector Integrated Thermal Transfer Plate |
| Sonstiges | UART, SPI, CAN, I2 C, I2 S, DMIC, GPIOs |
Preis auf Anfrage
| CPU | Quad-core ARM A57 @ 1.43 GHz |
| Speicher | 4 GB 64-bit LPDDR4 25.6 GB/s |
| Datenspeicher | microSD (not included) |
| GPU | 128-core Maxwell |
| Konnektivität | Gigabit Ethernet, M.2 Key E |
| Display | HDMI 2.0 and eDP 1.4 |
| Encoder/Decoder | 4K @ 30 | 4x 1080p @ 30 | 9x 720p @ 30 (HEVC), 4K @ 60 | 2x 4K @ 30 | 8x 1080p @ 30 | 18x 720p @ 30| (HEVC) |
| Abmessung | 0 mm x 80 mm x 29 mm |
| Sonstiges | GPIO, I2C, I2S, SPI, UART |
Preis auf Anfrage
| CPU | 6-core NVIDIA Carmel ARM®v8.2 64-bit CPU 6MB L2 + 4MB L3 |
| Speicher | 8 GB 128-bit LPDDR4x @ 1600 MHz 51.2GB/s |
| Datenspeicher | 16 GB eMMC 5.1 |
| GPU | 384-core NVIDIA Volta GPU with 48 Tensor Cores |
| PCIe | 1 x1 + 1x4 (PCIe Gen3, Root Port & Endpoint) |
| Konnektivität | 10/100/1000 BASE-T Ethernet |
| Display | 2 multi-mode DP 1.4/eDP 1.4/HDMI 2.0 |
| Encoder/Decoder | 2x464MP/sec (HEVC) 2x 4K @ 30 (HEVC) 6x 1080p @ 60 (HEVC) 14x 1080p @ 30 (HEVC), 2x690MP/sec (HEVC) 2x 4K @ 60 (HEVC) 4x 4K @ 30 (HEVC) 12x 1080p @ 60 (HEVC) 32x 1080p @ 30 (HEVC) 16x 1080p @ 30 (H.264) |
| DL Beschleuniger | (2x) NVDLA Engines |
| CSI | Up to 6 cameras (36 via virtual channels) 12 lanes MIPI CSI-2 D-PHY 1.2 (up to 30 Gbps) |
| Power | 10W|15W |
| Abmessung | 45 mm x 69.6 mm 260-pin SO-DIMM connector |
Preis auf Anfrage
| CPU | Dual-core NVIDIA Denver 2 64-bit CPU and quad-core Arm Cortex-A57 MPCore processor complex |
| Speicher | 4GB 128-bit LPDDR451.2GB/s |
| Datenspeicher | 16GB eMMC 5.1 |
| GPU | NVIDIA Pascal architecture with 256 NVIDIA CUDA cores |
| Konnektivität | Gigabit Ethernet, Wi-Fi |
| USB | 2 multi-mode DP 1.2/eDP 1.4/HDMI 2.01x 2 DSI (1.5Gbps/lane) |
| Display | 2 multi-mode DP 1.2/eDP 1.4/HDMI 2.01x 2 DSI (1.5Gbps/lane) |
| Encoder/Decoder | 1x 4Kp60 | 3x 4Kp30 | 4x 1080p60 | 8x 1080p30 (H.265)1x 4Kp60 | 3x 4Kp30 | 7x 1080p60 | 14x 1080p30 (H.264), 2x 4Kp60 | 4x 4Kp30 | 7x 1080p60 | 14x 1080p30 (H.265 & H.264 |
| CSI | Up to 5 cameras (12 via virtual channels)12 lanes MIPI CSI-2 (3x4 or 5x2)D-PHY 1.2 (up to 30Gbps) |
| Power | 7.5W -15W |
| Abmessung | 45 mm x 69.6 mm 260 pin SO-DIMM edge connector |
| Sonstiges | 1x SDIO | 2x SPI | 3x UART | 4x I2S | 4x I2C | 1x CAN | GPIOs |
SSG-520P-ACTR12H - 2U - Storage Server
Intel® Xeon® 3rd Gen Storage Server System - 2U DP up to 12+2x 3.5"/2.5" hot-swap NVMe/SATA/SAS
Preis auf Anfrage
| Anwendungen | Backup Storage, Data Center, HPC |
| CPU Sockel | Single Socket |
| CPU-Typ | Intel Xeon Scalable Ice Lake (3.Gen) |
| DIMM Steckplätze | 8 DIMMs |
| SSDs/HDDs | 12 |
| Formfaktor | 2U |
| Max. GPU Anzahl | N/A |
| PCIe Steckplätze | 4 PCIe Steckplätze |
| Systemtyp | Storage Server |
| Gehäuse Tiefe | 25.6" (650mm) |
| Speicher Formfaktor | 2.5", 3.5", M.2 |
| On-Board Netzwerk | 10GBase-T |
| Redundantes Netzteil | Redundantes Netzteil inkl. |
| Fernverwaltung | Fernverwaltung inkl. |
| Speicherschnittstelle | NVMe (optional), SAS (native), SATA (native) |
SSG-520P-ACTR12L - 2U - Storage Server
Intel® Xeon® 3rd Gen Storage Server System - 2U DP up to 12+2x 3.5"/2.5" hot-swap NVMe/SATA/SAS
Preis auf Anfrage
| Anwendungen | Backup Storage, Data Center, HPC |
| CPU Sockel | Single Socket |
| CPU-Typ | Intel Xeon Scalable Ice Lake (3.Gen) |
| DIMM Steckplätze | 8 DIMMs |
| SSDs/HDDs | 12 |
| Formfaktor | 2U |
| Max. GPU Anzahl | N/A |
| PCIe Steckplätze | 4 PCIe Steckplätze |
| Systemtyp | Storage Server |
| Gehäuse Tiefe | 25.6" (650mm) |
| Speicher Formfaktor | 2.5", 3.5", M.2 |
| On-Board Netzwerk | 10GBase-T |
| Redundantes Netzteil | Redundantes Netzteil inkl. |
| Fernverwaltung | Fernverwaltung inkl. |
| Speicherschnittstelle | NVMe (optional), SAS (native), SATA (native) |
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